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MS5536 (RoHS*)
SMD Gage Pressure MODULE
* * * * * Pressure range -400 to 1000 mbar (Optional -1000 to 400 mbar) 0.1 mbar Resolution Factory Calibrated (coefficients for software compensation stored onchip) 3-wire serial interface Low voltage / low power
DESCRIPTION
MS5536 is a family of high-resolution factory calibrated pressure sensors. The devices include a piezoresistive pressure sensor and a mixed signal IC. The 3-wire serial interface ensures simple communication with any microcontroller. The devices provide digital pressure and temperature information as 16-Bit data word each. In addition 64-Bit of individually calibrated compensation coefficients are stored allowing for a highly accurate software compensation of process spread and temperature effects. The devices have a very low standby current and automatically enter power down mode after each conversion. The optimum compromise of refresh rate and average current consumption can be defined by the application software.
FEATURES
* * * * * * 15-Bit ADC resolution Supply voltage 2.2 V to 3.6 V Supply current 5 A typ -40 to +60 C C Small size No external components required
APPLICATIONS
* * * * Medical application Blood pressure meter Air flow measurement HVAC application
BLOCK DIAGRAM
VDD MCLK Digital Interface ADC dig. Filter
Input MUX SENSOR +IN
DIN DOUT SCLK
-IN
Sensor Interface IC
SGND
Memory (PROM) 64 bits
GND
Fig.: 1 Block Diagram 5536
*
The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).
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PIN CONFIGURATION
1 2 3 4 5 6 7 14 13 12 11 10 9 8
14 13 12 11 10 9 8 1 2 3 4 5 6 7
Top view
Bottom view
Fig. 2: Pin configuration of MS5536-PJU, MS5536-NJU
PIN DESCRIPTION
Pin Name N/C VDD MCLK DIN DOUT SCLK GND N/C N/C N/C N/C N/C PV PEN Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Type P I I O I G Function Not Connected Positive Supply Voltage Master Clock (32.768kHz) Data Input Data Output Serial Data Clock Ground Not Connected Not Connected Not Connected Not Connected Not Connected Negative Programming Voltage Programming Enable
N I
NOTE Pins 13 (PEN) and 14 (PV) are only used by the manufacturer for calibration purposes and should not be connected.
PRESSURE UNIT CONVERSION
mbar 400.0 1000.0 kPa 40.00 100.00 bar 0.4000 1.0000 mm Hg 300.0 750.0 PSI 5.801 14.503 atm 0.3947 0.9869 mm H2O 4079 10198 Inches H2O 160.57 401.45
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ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Differential Overpressure (1), (2) CM Overpressure (1), (3) Storage Temperature (1) Symbol VDD Pdiff PCM TStg Conditions Min. -0.3 -5 -40 Max 4 5 10 +70 Unit V bar bar o C
NOTES 1) Storage and operation in an environment of dry and non-corrosive gases. 2) For a differential sensor, Differential Pressure is the difference of pressure at port 1 minus pressure at port 2. For a gage sensor Differential Pressure is the difference of pressure at the port minus pressure of the ambient air. 3) For a differential sensor Common Mode Pressure is the average of the pressure at port 1 and port 2. For a gage sensor Common Mode Pressure is the average of the pressure at the port and the pressure of the ambient air.
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Supply Current, average (1) during conversion (2) standby (no conversion) Current consumption into MCLK (3) Operating pressure range(4) Operating pressure range(4) Operating temperature range Conversion time External clock signal (5) Duty cycle of MCLK Serial Data Clock Symbol VDD Iavg ISC Iss p p Ta Tconv MCLK SCLK Conditions VDD = 3.0 V
(T=25 VDD=3.0V unless noted otherwise) C,
Min. 2.2
Typ. 3.0 5 1
Max 3.6
Unit V A mA A A
MCLK=32768Hz Pressure Range P devices Pressure Range N devices MCLK=32768Hz -400 -1000 -40 30000 40/60
3.5 0.5 1000 400 +60 35 35000 60/40 500
+25 32768 50/50
mbar mbar C ms Hz % kHz
NOTES 1) Under the assumption of one conversion every second. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5536. 2) During conversion time the sensor will be switched on and off in order to reduce power consumption; the total on time within a conversion is about 2 ms. The current specified is active only during this on time. 3) This value can be reduced by switching off MCLK while MS5536 is in standby mode. 4) Positive pressure corresponds to higher pressure at port 1 (nozzle port on plastic cap). 5) It is strongly recommended that a crystal oscillator be used because the device is sensitive to clock jitter. A square-wave form of the clock signal is a must.
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ELECTRICAL CHARACTERISTICS
DIGITAL INPUTS Parameter Input High Voltage Input Low Voltage Signal Rise Time Signal Fall Time Symbol VIH VIL tR tf Conditions VDD = 2.2...3.6V VDD = 2.2...3.6 V Min 80% VDD 0% VDD Typ (T=-40 .. 60 C C) Max Unit 100% VDD 20% VDD V V ns ns
200 200
DIGITAL OUTPUTS Parameter Output High Voltage Output Low Voltage Signal Rise Time Signal Fall Time AD-CONVERTER Parameter Resolution (1) Conversion Time Accuracy (2) MCLK=32768Hz 2 Symbol Conditions Min (T=25 VDD =3.0V) C, Typ Max Unit 15 35 7 Bit ms LSB Symbol VOH VOL tr tf Conditions ISource = 0.6 mA ISink = 0.6 mA (T=-40 .. 60 VDD = 2.2V..3.6V) C C, Min Typ Max Unit 75% VDD 0% VDD 100% VDD 20% VDD V V ns ns
200 200
NOTES 1) The ADC output range is from 5,000 counts to 37,000 counts, thus providing a 16-Bit output word. 2) Accuracy limited by the non-linearity of the ADC.
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PRESSURE OUTPUT CHARACTERISTICS
With the calibration data provided by the MS5536 system (stored in the interface IC) the following characteristics can be achieved: (VDD=3.0V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution (1) 0.1 mbar 1 Pressure Accuracy (2,4) Ta = 10 ...+40 C MS5536-PJU: p = -100...700 mbar MS5536-NJU: p = -700...100 mbar C Ta = 10 ... 40 MS5536-PJU: p = -400...1000 mbar MS5536-NJU: p = -1000...400 mbar Ta = -40...+60 C p = const. 12 month VDD = 2.2...3.6V -2.5 -9 -7 -1.5 0 2.5 9 +7 1.5 mbar mbar mbar mbar mbar/V 2 2 3 4 2
Maximum Error over Temperature Long-term Stability (3) Maximum Error over Supply Voltage (2)
NOTES 1) A stable pressure reading of the given resolution requires to take the average of 2 to 8 subsequent pressure values due to noise of the ADC 2) Specified values assume an offset adjustment at any given pressure e.g. p = 0 prior to the measurement 3) Specified values assume quadratic temperature compensation (Refer to the paragraph `second-order temperature compensation` in the section `FUNCTION'. 4) The long-term stability is measured with non-soldered devices
TEMPERATURE OUTPUT CHARACTERISTICS
The temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the pressure output. The reference temperature is 20 C. Parameter Resolution Accuracy (1,2) at reference temperature Ta = 10...+40 C Ta = -40...+60 C Maximum Change over Supply Voltage VDD = 2.2...3.6V -0.8 -1.5 -1.5 -0.1 Conditions (VDD=3.0V unless noted otherwise) Min Typ Max Unit 0.01 0.8 1.5 3 0.1 C C C C /V C
NOTES 1) Refer to the paragraph second-order temperature compensation in the section `FUNCTION' 2) p=0
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FUNCTION
GENERAL The MS5536 consists of a piezoresistive sensor and a sensor interface IC. The main function of the MS5536 is to convert the uncompensated analog output voltage from the piezoresistive pressure sensor to a 16-Bit digital value, as well as providing a 16-Bit digital value for the temperature of the sensor. * measured pressure (16-Bit) * measured temperature (16-Bit) "D1" "D2"
As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is necessary to compensate for these effects. This compensation procedure must be performed by software using an external microcontroller.
D1 Pressure
Sensor
D2 Word1...4
Calculation in external microcontroller
Temperature
For both pressure and temperature measurement the same ADC is used (sigma delta converter): * for the pressure measurement, the differential output voltage from the pressure sensor is converted * for the temperature measurement, the sensor bridge resistance is sensed and converted During both measurements the sensor will only be switched on for a very short time in order to reduce power consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. FACTORY CALIBRATION Each module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64Bit PROM of each module. These 64-Bit (partioned into four words of 16-Bit) must be read by the micrcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. PRESSURE AND TEMPERATURE MEASUREMENT The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in flow chart, Fig. 3 and Fig. 5. First WORD1 to WORD4 are read through the serial interface. This can be done once after reset of the microcontroller that interfaces to the MS5536. Next the compensation coefficients C1 to C6 are extracted using Bit-wise logical- and shift-operations (refer to Fig. 4 for the Bit-pattern of word 1 to word 4). For the pressure measurement, the microcontroller has to read the 16-Bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance once every second). Then, the compensated pressure is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic temperature compensation according to Fig. 5). All calculations can be performed with signed 16-Bit variables. Results of multiplications may be up to 32-Bit long (+sign). In the flow according to Fig. 3 each multiplication is followed by a division. This division can be performed by Bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16-Bit). For the timing of signals to read out WORD1 to WORD4, D1, and D2 please refer to the paragraph `Serial Interface'.
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Start System initialisation Read calibration data (factory calibrated) from PROM of MS5536
Word1, Word2, Word3 and Word4 (4x16 Bit)
Basic equations:
Example:
Word1 = 45834 Word2 = 61787 Word3 = 49110 Word4 = 4060
Convert calibration data into coefficients: (see bit pattern of Word1-Word4)
C1: Pressure sensitivity (13 Bit) C2: Pressure offset (13 Bit) C3: Temperature coefficient of pressure sensitivity (9 Bit) C4: Temperature coefficient of pressure offset (9 Bit) C5: Reference Temperature (12 Bit) C6: Temperature coefficient of the temperature (8 Bit)
SENST1 OFFT1 TCS TCO Tref TEMPSENS
C1 = 4054 C2 = 4060 C3 = 179 C4 = 241 C5 = 2826 C6 = 91
Pressure and temperature measurement
Calculate calibration temperature
UT1=4*C5+15136
D1 = 15832
Read digital pressure value from MS5536
D1 (16 Bit)
D2 = 28877 UT1= 26440 28877
Read digital temperature value from MS5536
D2 (16 Bit)
Calculate actual temperature
Difference between actual temperature and reference temperature:
dT(D2) = D2 - Tref TEMP(D2)=20 +dT(D2)*TEMPSENS
dT
= 2437
dT = D2 - UT1
Actual temperature:
TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01C)
9
TEMP = 3680 = 36.80 C
Calculate temperature compensated pressure
Offset at actual temperature:
OFF(D2)=OFFT1+TCO*dT(D2)
12
OFF = C2 +10381+ ((C4-243)*dT)/2
Sensitivity at actual temperature:
OFF
= 14440
SENS(D2)=SENST1+TCS*dT(D2)
11 12
SENS = 14710 X = 4999 = 9998 = 99.98 mmHg
SENS = C1 + 10179+((C3+222)*dT)/2 X = (SENS * (D1-OFF))/2 P = 2X P = X*1365/2
9
Temperature compensated pressure:
(weight: 0.01mmHg) (weight: 0.01mbar)
P(D1,D2)= SENS(D2)*(D1- OFF(D2))
P
Display pressure and temperature value
Fig. 3: Flow chart for pressure/temperature reading and software compensation. NOTES 1) Readings of D2 can be done less frequently, but the display will be less stable in this case 2) For a stable display of 0.1 mm Hg resolution or below, it is recommended to display the average of at least 8 subsequent pressure values.
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C3/II (8-Bit) Word 1
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5
C5/II(8-Bit)
DB4 DB3 DB2 DB1 DB0
C4/II (8-Bit) Word 2
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5
C6(8-Bit)
DB4 DB3 DB2 DB1 DB0
C5/I (4-Bit) Word 3
DB11 DB10 DB9 DB8 DB11 DB10 DB9 DB8 DB7
C1/II (12-Bit)
DB6 DB5 DB4 DB3 DB2 DB1 DB0
C1/I Word 4
DB12
C4/I
DB8
C3/I
DB8 DB12 DB11 DB10 DB9 DB8 DB7
C2 (13-Bit)
DB6 DB5 DB4 DB3 DB2 DB1 DB0
Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4. SECOND-ORDER TEMPERATURE COMPENSATION In order to obtain full accuracy over the whole temperature range, it is recommended to compensate for the non-linearity of the output of the temperature sensor. This can be achieved by the second-order temperature calculation, i.e. by replacing the block `Calculate actual temperature' in flow chart Fig. 3 by the following sequence:
D2UT1?
yes
no
Calculate actual temperature
Difference between the actual temperature and reference temperature: 18 dT = (D2 - UT1) - ((D2-UT1)*(D2-UT1))/2 Actual temperature in C 9 TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01 C)
Calculate actual temperature
Difference between the actual temperature and reference temperature: 18 dT = (D2 - UT1) - (9*(D2-UT1)*(D2-UT1))/2 Actual temperature in C 9 TEMP = 2000 + dT*(C6+262)/2 (weight: 0.01 C)
Fig. 5: Flow chart for calculating the temperature to the optimum accuracy. The value for dT thus obtained is then used for the calculation of the temperature compensated pressure as shown in Fig. 3.
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SERIAL INTERFACE
The MS5536 communicates with microprocessors and other digital systems via a 3-wire synchronous serial interface as shown in Fig. 1. The SCLK (Serial Clock) signal initiates the communication and synchronizes the data transfer with each Bit being sampled by the MS5536 on the rising edge of SCLK and each Bit being sent by the MS5536 on the rising edge of SCLK. The data should thus be sampled by the microcontroller on the falling edge of SCLK and sent to the MS5536 with the falling edge of SCLK. The SCLK-signal is generated by the microprocessor's system. The digital data provided by the MS5536 on the DOUT pin is either the conversion result or the software calibration data. In addition the signal DOUT (Data Out) is also used to indicate the conversion status (conversion-ready signal, see below). The selection of the output data is done by sending the corresponding instruction on the pin DIN (Data Input). Following is a list of possible output data instructions:
* * * * *
Conversion start for pressure measurement and ADC-data-out Conversion start for temperature measurement and ADC-data-out Calibration data read-out sequence for word 1 and word 3 Calibration data read-out sequence for word 2 and word 4 RESET sequence
"D1" "D2"
(Figure 6a) (Figure 6b) (Figure 6c) (Figure 6d) (Figure 6e)
Every communication starts with an instruction sequence at Pin DIN. Fig. 6 shows the timing diagrams for the MS5536. The device does not need a `Chip select' signal. Instead there is a Start Sequence (3-Bit high) before each Setup Sequence and Stop Sequence (3-Bit low) after each Setup Sequence. The Setup Sequence consists in 4-Bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or temperature- (D2) reading the module acknowledges the start of a conversion by a low to high transition at Pin DOUT during the last Bit of the Stop Sequence. Two additional clocks at SCLK are required after the acknowledge signal. Then SCLK is to be held low by the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in the microcontroller. The microcontroller may now read out the 16-Bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data read-out sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion.
The RESET-sequence is special as its unique pattern is recognized by the module in any state. By consequence it can be used to restart if synchronization between the microcontroller and the MS5536 has been lost. It is thus recommended to send the RESET-Sequence before each Conversion Sequence to avoid hanging up the protocol permanently in case of electrical interference. This sequence is 21-Bit long. The DOUT signal might change during that sequence (see Fig. 6e).
Conversion start for pressure measurement and ADC-data-out "D1":
end of conversion
DOUT SCLK
start of conversion
conversion (33ms)
ADC-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1
ADC-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIN
sequence: START+P-measurement Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Start-bit Setup-bits Stop-bit
Fig. 6a: D1 acquisition sequence
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DOUT SCLK
Conversion start for temperature measurement and ADC-data-out "D2":
end of conversion
start of conversion
conversion (33ms)
ADC-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1
ADC-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIN
sequence: START+T-measurement Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Start-bit Setup-bits Stop-bit
Fig. 6b: D2 acquisition sequence
DOUT SCLK Calibration data read out sequence for word 1/ word 3:
coefficient-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 sequence: coefficient read + address Bit0 Bit1 Bit2 Start-bit Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11 Setup-bits Stop-bit address word 1 address word 3
coefficient-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIN
Fig. 6c: W1, W3 reading sequence
DOUT SCLK Calibration data read out sequence for word 2/ word 4:
coefficient-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 sequence: coefficient read + address Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11 Start-bit Setup-bits Stop-bit address word 2 address word 4
coefficient-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DIN
Fig. 6d: W2, W4 reading sequence
DOUT SCLK RESET - sequence:
DIN
sequence: RESET Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Bit16 Bit17 Bit18 Bit19 Bit20
Fig. 6e: Reset sequence (21-Bit)
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APPLICATION INFORMATION
GENERAL
The MS5536 consists in a sensor die and a mixed signal interface IC on a single ceramic substrate with Pb-free leads attached. It is compatible with standard PCB-assembly technologies (Pick and Place followed by IR-reflow soldering). Single sided PCB layout is possible. The device directly interfaces to a standard microcontroller, no costly external components like Instrumentation Amplifiers or A/D converters are required. A mark on the ceramic substrate indicates pin 1 (see Fig. 2). The silicon pressure transducer, the IC and the bonding wires are protected against humidity by a silicone gel and against mechanical damage by a plastic cap. The cap is also used as the pressure port. The MS5536 does not show pressure hysteresis effects. The simple digital 3 wire synchronous serial interface eliminates all sensitive analogue signal lines on the PCB with their often critical routing and guarding issues. The protocol does not require specific interface cells and can be implemented on any microcontroller using standard I/Os. The required external clock-signal of 32.768kHz is standard in the watch industry and readily available in most hand-held applications. The MS5536 is well suited for battery powered portable devices. This is due to the low supply voltage of 2.2V and the small amount of computing power required to calculate the compensated values for pressure and temperature (use of 4-Bit microcontrollers is possible). No costly end-of-line calibrations are required as the MS5536 contains factory stored calibration coefficients. In order to further enhance accuracy it is recommended to periodically recalibrate the device offset in the application software. This can be achieved by reading the compensated pressure in a known state, preferably at p=0 (e.g. Blood Pressure Meters with vent open). The detected difference between displayed and actual pressure can be memorized and subtracted from following readings. The pressure range and port configurations make the MS5536 well suited for applications like blood-pressure metering, air flow and pressure measurements in HVAC-systems and liquid level detection.
3V-Battery
LCD-Display
VDD 32.768 kHz XTAL1
MS5536
VDD MCLK DIN DOUT SCLK GND
47uF Tantal
XTAL2
Keypad 4/8bit-Microcontroller
VSS
EEPROM
optional
Fig. 7: Application example of the MS5536 for a battery powered device
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DEVICE PACKAGE OUTLINES
1.62 [0.064] 6.1[0.24] 3[0.12]
Device marking pad (7x0.8)
Pin 1 6.88 [0.27]
Pin1
13 [0.51]
10.16 [0.4]
Negative pressure port
1.27 [0.05]
9.2 [0.36] Top View
13.36 [0.53] Bottom View
Positive pressure port
3.0 [0.12] 10.4 [0.41] 4.9 [0.19] 3.1 [0.12] 0.635 [0.025] 12.14 [0.48] Side view All dimensions in mm [inch]
Fig. 8: Device package outlines of MS5536-PJU / MS5536-NJU
PAD LAYOUT FOR MS5536-PJU 1.27 [0.050] 0.7 [0.028]
10.8 [0.425]
1.3 [0.051]
All dimension in mm [inch] Fig. 9: recommended pad-layout for MS5536-PJU / MS5536-NJU
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0.46 [0.02]
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ASSEMBLY
SOLDERING
Please refer to the application note AN808 for all soldering issues.
MOUNTING
The MS5536 can be placed with automatic Pick&Place equipment using a special vacuum nozzle. It will not be damaged by the vacuum. For a good mechanical stability, it is important to solder all contact pads. The Pins PEN and PV must be left open or connected to Vdd. Do not connect to GND!
CONNECTING THE PRESSURE PORT
The best connection to the pressure port is achieved with a flexible tube fitted to the full length of the nozzle. Care should be taken to keep the nozzle clean. The tube should be flexible enough to minimize the mechanical stress on the module (see Fig. 10)
Fig. 10: connection to pressure port
CLEANING
The MS5536 has been manufactured under cleanroom conditions. It is therefore recommended to assemble the sensor under class 10'000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type `No-Clean' shall be used. CLEANING MIGHT DAMAGE THE SENSOR!
ESD PRECAUTIONS
The electrical contacts except programming pads are protected against ESD according to 2KV HBM (human body model). The programming pads are more sensitive due to the nature of the OTP programming cells that store the calibration coefficients. The breakdown voltage of PEN and PV is 200V HBM typical. It is therefore essential to ground machines and personal properly during assembly and handling of the device. The MS5536 is shipped in antistatic packing material. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material.
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ORDERING INFORMATION
Product Code
MS5536-PJU MS5536-NJU
Product
SMD Gage Pressure Module RoHS SMD Gage Pressure Module RoHS
Art.-Nr.
325536001 325536002
Package
Gage with plastic cap, upright nozzle, vent hole on backside, J-Lead type Gage with plastic cap, upright nozzle, vent hole on backside, J-Lead type
Comments
Pressure Range (port1 - port2): -400 mbar ...+1000 mbar Pressure Range (port1 - port2): -1000 mbar ...+400 mbar
FACTORY CONTACTS
Intersema Sensoric SA Ch. Chapons-des-Pres 11 CH-2022 BEVAIX SWITZERLAND Tel. (032) 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: http://www.intersema.ch
NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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